「adwill d-485h」熱門搜尋資訊

adwill d-485h

「adwill d-485h」文章包含有:「ADWILLkatalog2020」、「Adwill:Semiconductor」、「DSeries紫外線硬化型切割膠帶」、「EP003647832A1*」、「ProductPortfolioTapexEquipment2023」、「TAIKO晶圓用切割膠帶」、「UVCur」、「UVCurableDicingTape」、「琳得科Adwill伴您一同邁入新世代半導體製程」

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ADWILL katalog 2020
ADWILL katalog 2020

https://www.linteceurope.com

D-821HS. PO. D-455H. Wafer with LC Tape. Standard. PO. D-676(S) / D-676H(S) / D-686H. TAIKO Wafer. Standard. PVC. D-176D. PO. D-485H. Plasma Dicing. Standard.

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Adwill:Semiconductor
Adwill:Semiconductor

https://www.adwill-global.com

The LINTEC Adwill series includes UV curable dicing tapes, high performance back grinding tapes, dicing die bonding tapes required for semiconductor packaging, ...

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D Series 紫外線硬化型切割膠帶
D Series 紫外線硬化型切割膠帶

https://www.lintec.com.tw

Adwill D Series可因應作業製程而改變特性的劃時代紫外線硬化型切割膠帶(UV Curable Dicing Tape)。具良好的黏著力,於切割時可確實保持並固定晶片,經紫外線照射,降低 ...

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EP003647832A1*
EP003647832A1*

https://data.epo.org

Tape (1): UV curable dicing tape, available from Lintec Corporation, trade name ADWILL-D-485 H, adhesive layer thickness 5 mm, adhesive ...

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Product Portfolio Tape x Equipment 2023
Product Portfolio Tape x Equipment 2023

https://www.linteceurope.com

D-825W / D-841 / D-847W. Stealth Dicing. Singulation by Expansion. PVC. D-176D. PO ... D-485H / D-611 / D-611H / D-686H. Adwill D-Series is an epoch-making line ...

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TAIKO晶圓用切割膠帶
TAIKO晶圓用切割膠帶

https://www.lintec.com.tw

TAIKO晶圓用切割膠帶 ; 產品名稱. D-171D. D-174D. D-175D*. D-485H ; 膠帶總厚度. 90μm. 90μm. 90μm. 85μm ; 黏著力( 紫外線照射前). 5000. 740. 580. 4900.

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UV Cur
UV Cur

https://lintec-usa.com

D-485H/678/686H. D-174E/820. D-877H/867A. D-611/611H. RoHS 2.0 compliance. PVC. D ... LINTEC OF AMERICA, INC. www.adwill-global.com/en.

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UV Curable Dicing Tape
UV Curable Dicing Tape

https://www.adwill-global.com

Adwill D series is an epoch-making line of UV curable dicing tapes whose features can be changed in accordance with operational process.

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琳得科Adwill伴您一同邁入新世代半導體製程
琳得科Adwill伴您一同邁入新世代半導體製程

https://www.digitimes.com.tw

D-175D的基材為環保型PVC,具良好的黏著力,於切割時可確實保持並固定晶片,經紫外線照射,降低黏著力以提升撿晶作業效率,並可抑制晶片Chipping及殘膠等 ...